| Volume | 500ml / 2L |
|---|---|
| Particles |  （Medium cut to finishing ） |
| Viscosity | 2 |
| Liquid color | White |
| Characteristics | Non-silicone/wax-free, compatible with high-grade paint |
| Nature | Water-soluble (dispersion)（*NOTE: Regarding the nature）（※NOTE: Regarding the nature） |
| Accessories | [500ml] Tapered cap x 1 |
After polishing the sanded painted surface
with Expeed and other company's product,
we measured with a film thickness meter
(compliant with JIS standards)
and conducted comparative verification.
Measurement date:2022/2/18
Weather:Sunny weather
Temperature:10°C
Humidity:30%
Film thickness meter:Kett LZ-373 Dual type (compliant with JIS K 5600_1_7 Testing methods for paints)
Sanding pad:#2000 water resistant paper compliant with JIS R 6253
Polisher:RUPES LHR15 MarkII
Buffing pad:HAYABUSA MOLT AIR FH3-22
Particles:Medium cut to finishing Viscosity :3 Characteristics:Non-silicone/wax-free
As a result, Expeed demonstrates about 1/2 the cutting amount.
There is a reason why you don't feel any response even when you polish by putting force with Expeed, like "beating the air". This is a feeling that occurs because the size of the particles is uniform. If you compare it to a tire, it is a rattling and unpleasant ride if they are all different sizes, and it is a smooth and comfortable ride if they are all the same size. Expeed’s polish feeling is the same principle.
Tire sizes are all different
Uncomfortable and bumpy ride
Tire sizes are all the same
Comfortable and smooth ride
Next-generation compound diverted from the world's highest level ultra-precision smooth polishing technology
This product is the next generation abrasive based on sub-micron polyhedral particles (hereinafter abbreviated as SPP) that are diverted from the ultra-precision smooth polishing technology of silicon wafers, which boast the highest flatness of all materials in the world.
Note: SPP is an abbreviation for sub-micron polyhedral particles. High-performance abrasive particles made by forming uniform sub-micronized particles into polyhedra after the refining process, applying ultra-precision smooth polishing technology of silicon wafers.
High-performance abrasive particles that have been developed by applying ultra-precision smooth polishing technology for silicon wafers, focusing again on alumina oxide, which is used as a base material for general abrasives. While the error in the particle size of general abrasives is ± 100% or more, the particle size of SPP is made uniform to 0.8 μ ± 20% through the refining process. Besides, by controlling the shape of the particles with the unique technology, polyhedral particles with higher cutting force are formed. Using SPP refined in such a complicated manufacturing process as a base material, Expeed has got various characteristics.
>> What is a silicon wafer?
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Silicon wafers are not seen in everyday life. This is a substrate material necessary for semiconductor manufacturing and an ultra-flat, ultra-clean disk that boasts the highest flatness among all substances in the world and eliminates fine irregularities and fine particles to the limit, formed by slicing ingot made by crystallizing silicon with high purity to about 1 mm and polishing the surface to a mirror finish. State-of-the-art semiconductors require the highest quality silicon wafers that require advanced technology.
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Before polishing
After polishing
Before polishing
After polishing
Due to the overwhelming uniformity of the abrasive particles of SPP, there is almost no change in the particle size before and after polishing. In contrast, in general crushing type, there is a variation in size in micro units. In general compound, the size of the abrasive particles has a range of 10 µm or more from the reference value, whereas the abrasive particles of SPP show overwhelming uniformity within a range of only about 1 µm from the reference value.
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Not only the uniformity of the particle size, but also the polishing efficiency is improved by forming each of the abrasive particles into an intentional polyhedron and aligning them in the same shape.
>> What is a silicon wafer?
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* Click for details of each feature
Characteristics
1
Reduction of work time
* Polishing time is converted based on 14 m2 as one car from the results of a A3 size test panel. (Conversion to the erasing process is 1/1400 above)
Expeed︎ UNIACTIVE is extremely effective in working time not only with a conventional rotary action polisher, but also with a long throw polisher like RUPES. SPP (sub-micron polyhedral particles) with uniform particle size realizes stress-free polishing in a short time without causing unnecessary scratches.
It is compatible with any types of coatings, and can perform accurate polishing* even for Scratch Shield paint.
* When using a long throw polisher
Characteristics
3
Light polish feeling and clean finish without excessive oil
Characteristics
4
No cissing of the paint
Characteristics
5
Supports polishing of various parts other than painted surfaces
It can be used for multiple purposes such as
polishing plastic materials, plating moldings, B pillars, glass, etc.
It is very effective in improving the efficiency of parts polishing work.
> Expeed
