* This item has been discontinued.
Please contact us for an alternative.
| Old order number | 67192--- |
|---|---|
| Specifications | 150φ×30T |
| Country of origin | U.S.A. |
- FE News»
- PPS News»
- Nov. 18, 2025
- Holiday Closing Notice [2025-2026]
- Jun. 23, 2025
- Notice of Specification Change for ECHELON Zen-Xero Series Maintenance Bags
- Oct. 31, 2024
- [News Release R-1020] Release of "ECHELON Zen-Xero DYNAMIX”
- May. 15, 2024
- [News Release R-1019] Release of "ECHELON Ver.3.0”
- Oct. 02, 2023
- [News Release R-1018]Compound that achieves a genuine finish Full Renewal of “KATANA” Series
CCS FLAT Blue 150φ (Ultra Micro Cell)
Background of CCS Technology
Conventional foam pads absorb polish too quickly. This reduces polish and pad performance because most of the polish is trapped below the working surface of the pad. CCS technology™ solves this common problem using strategic patterns of partially closed foam cells.
Uniformed dimple patterns
that maximizes performance of polishing compounds
The center protrusion controls stagnation and uniform spread of polishing compounds and achieves higher quality finish.
Benefits of CCS Technology
- Slow Rate of Polish Absorption
- CCS pockets gradually release polish as needed by the operator.
- Prevents Pad Skipping
- CCS pockets reduce surface tension allowing operator to run pad flat on working surface.
- Creates Less Heat
- CCS pockets reduce surface contact resulting in less friction generated heat.
